openMEMSdesign: various open source and reverse engineering MEMS layouts Reference MEMS - nice die pictures pressure sensor simple CMOS pressure sensor pressure_sensor resonators claped-clamped beam microresonator in BDRIE, see documentation here Tang_resonator resonator accelerometers uni_axial_polysilicon_accelerometer bulk micromachined uni_axial accelerometer TPU_accelerometer uniaxial_BDRIE_accelerometer gyros RR-gyro LL-gyro IMU Model of an MPU-6050 6 axis accelerometer/gyroscope micromirrors LMGT 2D micromirror micromirror cascaded micromirror TI DMD micromirror compliant mechanisms Sperrklinke mechanical_amplifier indenter Schrittschaltwerke Micromachined actuators with braking mechanisms Schrittschaltwerke piezoelectric circuits BAW filter structure with internal electrostatic shielding US20190103851A1 BAW SMR filter: BAW filter in iPhone-XR/QM76018 RF-FEM test structures http://www-tcad.stanford.edu/~chan/mems/canonical/data_files/layout.gds Hall_structures piezoresistive_structures microfluidics / BioMEMS microfluidic_mixer fluidic logic =========================================================================== commercial MEMS processes: X-FAB: XMS10 and XMB10 TUC ZfM: AIM (Airgap Insulation of Microstructures) SCREAM (Single Crystal Reactive Etching and Metallization) BDRIE (Bonding and Deep Reactive Ion Etching), 40-50um thick device layer IMEC: SiGeMEMS STMicroelectronics: ThELMA (Thick Epitaxial Layer for Microactuators and Accelerometers) Tronics/TDK: HARM GE: Polaris (5 mask layers with WLP and TSV, 100um thick device layer, 10x10mm area image)