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MotionSense IMU

MotionSense IMU is a custom 2-layer PCB built around the ST LSM6DSM 6-axis accelerometer and gyroscope.

The board takes 5 V from USB-C, regulates it to 3.3 V, and breaks out the IMU's I2C interface and interrupt signal through a 5-pin header.

MotionSense IMU 3D Render

Hardware

  • LSM6DSM 6-axis accelerometer + gyroscope
  • AP2112K-3.3 LDO regulator
  • USB-C 5 V input
  • 4.7 kΩ pull-up resistors on SDA and SCL
  • Decoupling capacitors for the regulator and IMU
  • 5-pin interface header
  • 2-layer PCB
  • Board size: approximately 35 mm × 27 mm

Pinout

Pin Signal
1 3V3
2 GND
3 SDA
4 SCL
5 INT1

Design

The schematic and PCB were designed in KiCad.

During routing, I experimented with Quilter and Freerouting before bringing the design back into KiCad for final cleanup and verification.

The final design passes KiCad DRC with:

  • 0 violations
  • 0 unconnected items

Gerber and drill files were generated and inspected before manufacturing.

Schematic

MotionSense IMU Schematic

The schematic includes the USB-C power input, AP2112K 3.3 V regulator, LSM6DSM IMU, I2C pull-up resistors, decoupling capacitors, and J2 breakout header.

The editable KiCad schematic is available in MotionSense_IMU.kicad_sch.

PCB Layout

MotionSense IMU PCB Layout

The board is a 2-layer design with USB-C power input on one side and the I2C breakout header on the opposite side.

Manufacturing

Rev 1 was submitted to JLCPCB for fabrication and assembly in August 2026.

Five PCBs were ordered, with two boards receiving component assembly.

The 1×5 J2 header is intentionally left unpopulated and will be soldered manually during bring-up.

Files

  • MotionSense_IMU.kicad_pcb — KiCad PCB layout
  • MotionSense_IMU.kicad_pro — KiCad project
  • MotionSense_IMU.kicad_sch — KiCad schematic
  • BOM.csv — bill of materials
  • MotionSense_IMU_Rev1_Gerbers.zip — Gerber and drill files
  • pcb_3D.png — 3D board render
  • pcb_layout.png — PCB layout image
  • schematic.png — schematic image

Fabrication Files

The Rev 1 Gerber and drill files used for manufacturing are included in the repository.

Download Gerber + drill files

Current Status

Rev 1 has been ordered for fabrication and assembly.

The PCB design and manufacturing files are complete. The next stage is hardware bring-up and firmware validation once the assembled boards arrive.

Bring-Up Plan

  1. Inspect the assembled board for soldering or placement issues.
  2. Solder the J2 header.
  3. Check for shorts between 3.3 V and GND.
  4. Power the board through USB-C.
  5. Verify the 5 V input and 3.3 V regulator output with a multimeter.
  6. Connect an ESP32 to SDA, SCL, and GND.
  7. Detect the LSM6DSM over I2C.
  8. Read the WHO_AM_I register to confirm communication.
  9. Read live accelerometer and gyroscope data.
  10. Test the INT1 interrupt output.

Next Steps

  • Prepare ESP32 bring-up firmware
  • Complete electrical testing
  • Validate accelerometer and gyroscope measurements
  • Test interrupt functionality
  • Document test results
  • Record any changes needed for Rev 2

Project Goal

The goal of this project is to work through the complete PCB development process, from schematic capture and component selection through layout, manufacturing, assembly, and hardware validation.

About

2-layer USB-C powered LSM6DSM IMU breakout board designed in KiCad

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